NEC Develops Fire-Resistant Bioplastic for Electronics

NEC Corporation of Japan announced on January 26, 2004 that it has successfully developed a highly flame resistant vegetable-based plastic, or bioplastic, without the use of flame retardants composed of environmentally harmful chemicals such as halogen and phosphorus. The development has been achieved by adding a safe inorganic heat-absorbing substance as well as special additives that improve bioplastic properties.

Bioplastics, mainly composed of polylactic acid, a polymerized lactic acid made of fermented corn and other plants, have already been mass produced. These plastics, however, are not suitable for use in electronic products such as office equipment because of their low fire resistance.

The newly developed bioplastic has attained the highest level of flame resistance in Underwriters Laboratories (UL) Standards, the standards most commonly used in the United States for flame resistance. This plastic also has other important properties for resin used for electronic equipment cases, such as heat resistance, moldability and strength, comparable to the fiber-reinforced polycarbonate used in desktop office equipment.

This development will make it possible to widely use bioplastics, instead of petroleum-based plastics, for electronic devices, and also will improve the environmental soundness of electronic products. NEC aims to use the new bioplastic in electronic equipment by 2006.

http://www.nec.co.jp/press/en/0401/2601.html

Posted: 2004/04/19 07:29:53 PM
Japanese version